The interfacial reaction between In-48Sn solder and polycrystalline Cu substrate during solid state aging
Author:
Funder
National Key R&D Program of China
CAS
Osaka University
Publisher
Elsevier BV
Subject
Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials
Reference22 articles.
1. Properties of lead-free solder alloys with rare earth element additions
2. Diffusion and phase transformations during interfacial reaction between lead-tin solders and palladium
3. Soldering reactions between In49Sn and Ag thick films
4. Spalling behavior of interfacial intermetallic compounds in Pb-free solder joints subjected to temperature cycling loading
5. Directional growth of Cu3Sn at the reactive interface between eutectic SnBi solder and (100) single crystal Cu
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1. Effect of ZnO nanoparticle addition on the wettability, microstructure and mechanical properties of In-45.6Sn-5Bi low temperature solder;Journal of Materials Science;2024-08
2. Low-temperature phase equilibria of the ternary Cu-In-Sn system at In-rich corner;Materialia;2024-08
3. Pulse electric current induced interfacial ductile phase on improving the mechanical properties of the Au20Sn/Cu solder joints;Journal of Materials Science: Materials in Electronics;2024-06
4. Comparison of high-speed shear properties of low-temperature Sn-Bi/Cu and Sn-In/Cu solder joints;Journal of Materials Science: Materials in Electronics;2024-03
5. Identification and Evolution of Intermetallic Compounds Formed at the Interface between In-48Sn and Cu during Liquid Soldering Reactions;Metals;2024-01-23
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