Concurrent nucleation, formation and growth of two intermetallic compounds (Cu6Sn5 and Cu3Sn) during the early stages of lead-free soldering
Author:
Funder
National Science Foundation
Publisher
Elsevier BV
Subject
Metals and Alloys,Polymers and Plastics,Ceramics and Composites,Electronic, Optical and Magnetic Materials
Reference51 articles.
1. A generalized field method for multiphase transformations using interface fields
2. Phase-field modeling of eutectic solidification
3. Early stages of intermetallic compound formation and growth during lead-free soldering
4. Nucleation kinetics of Cu6Sn5 by reaction of molten tin with a copper substrate
5. Multiphase Field Simulations of Intermetallic Compound Growth During Lead-Free Soldering
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