Nanostructured compliant interconnections for advanced Micro-Electronic packaging
Author:
Funder
National Natural Science Foundation of China
Publisher
Elsevier BV
Reference203 articles.
1. Fazlullah F, Kaiser MdS, Ahmed SR. A Comparative Electro-Mechanical Characterization of Tin-Lead Solder with Equal Proportion. 2020 Int. Conf. Comput. Electr. Commun. Eng. ICCECE, 2020, p. 1–6. doi: 10.1109/ICCECE48148.2020.9223101.
2. High lead solder (over 85 %) solder in the electronics industry: RoHS exemptions and alternatives;Menon;J Mater Sci Mater Electron,2015
3. Inhibition of intermetallic compounds growth at Sn–58Bi/Cu interface bearing CuZnAl memory particles (2–6 μm);Zhang;J Mater Sci Mater Electron,2020
4. Ultrasonic-assisted connection of Cu/Cu structure using Sn58Bi solder enhanced by B4C nanoparticles;Chen;J Mater Process Technol,2023
5. Effect of AlN on the microstructure evolution of Cu/Sn58Bi/Cu solder joints for 3D packaging at different bonding times;Wang;J Mater Res Technol,2023
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