Retardation of electromigration-induced Ni(P) consumption by an electroless Pd insertion layer
Author:
Publisher
AIP Publishing
Subject
Physics and Astronomy (miscellaneous)
Link
http://aip.scitation.org/doi/pdf/10.1063/1.3449119
Reference13 articles.
1. Electroless Ni/Immersion Au interconnects: Investigation of black pad in wire bonds and solder joints
2. Reliability study of the electroless Ni–P layer against solder alloy
3. Surface finishes in a lead-free world
4. Handbook of Lead-Free Solder Technology for Microelectronic Assemblies
5. Current density dependence of electromigration-induced flip-chip Cu pad consumption
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2. Effects of Zn and Ga Additions to Suppress PdSn4 Growth at a Solder/Pd Interface Under Current Stressing;Journal of Electronic Materials;2017-07-18
3. Study of electromigration resistance of (Pd,Ni)Sn4 phase in lead-free solder joints;Journal of Alloys and Compounds;2016-01
4. Electromigration effect on Sn-58 % Bi solder joints with various substrate metallizations under current stress;Journal of Materials Science: Materials in Electronics;2015-10-14
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