Electromigration-induced remarkable intermetallic compound (IMC) formation in micro joints and its prevention-Reference-Cited by-同舟云学术

Electromigration-induced remarkable intermetallic compound (IMC) formation in micro joints and its prevention

Published:2023-05 Issue: Volume:24 Page:3889-3900
ISSN:2238-7854
Container-title:Journal of Materials Research and Technology
language:en
Short-container-title:Journal of Materials Research and Technology

Author:

Lee Pei-Tzu^ORCID,Lee Cheng-Yu,Hsieh Wan-Zhen,Chen Chih-Tsung,Ho Cheng-En

Publisher

Elsevier BV

Subject

Metals and Alloys,Surfaces, Coatings and Films,Biomaterials,Ceramics and Composites

Reference44 articles.

1. Effect of Ni(P) thickness in Au/Pd/Ni(P) surface finish on the electrical reliability of Sn-3.0Ag-0.5Cu solder joints during current-stressing;Kim;J Mater Res Technol,2021

2. Interfacial microstructure and mechanical reliability of Sn-58Bi/ENEPIG solder joints;Chen;Processes,2022

3. Enhancement of bonding strength in BiTe-based thermoelectric modules by electroless nickel, electroless palladium, and immersion gold surface modification;Nguyen;Appl Surf Sci,2021

4. Comparative study of normal and thin Au/Pd/Ni(P) surface finishes with Sn-3.0Ag-0.5Cu solder joints under isothermal aging;Back;J Mater Sci Mater Electron,2021

5. Effect of Ni(P) thickness in Au/Pd/Ni(P) surface finish on the electrical reliability of Sn-3.0Ag-0.5Cu solder joints during current-stressing;Kim;J Alloys Compd,2021

Cited by 2 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Current-induced solder evolution and mechanical property of Sn-3.0Ag-0.5Cu solder joints under thermal shock condition;Journal of Alloys and Compounds;2024-01

2. The doped Pd on the crystal calculation and intermetallic property of low-temperature soldered ENEPIG substrates;Journal of Materials Research and Technology;2023-11