Interfacial reaction and intermetallic compound formation of Sn–1Ag/ENIG and Sn–1Ag/ENEPIG solder joints
Author:
Publisher
Elsevier BV
Subject
Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials
Reference26 articles.
1. Properties of lead-free solder alloys with rare earth element additions
2. Lead-free Solders in Microelectronics
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5. Study on low-Ag content Sn–Ag–Zn/Cu solder joints
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