1. The application of bi-based solders for low temperature reflow to reduce cost while improving SMT yields in client computing systems;S M Mokler;Proceedings of SMTA International Conference,2016
2. Cu/Sn-58Bi composite solder joint assembled using a low-temperature reflow process for PoP technology;Y A Shen;Mater. Des,2019
3. A comparative study of thermal fatigue life of Eutectic Sn-Bi, Hybrid Sn-Bi/SAC and SAC solder alloy BGAs;C Cai;Microelectron. Reliab,2021
4. Effect of isothermal aging on the microstructure, shear behavior and hardness of the Sn58Bi/Sn3.0Ag0.5Cu/Cu solder joints;R Xu;Results Phys,2019
5. A new low-temperature solder assembly technique to replace eutectic Sn-Bi solder assembly;L Sun;Micromachines,2022