Electromigration effect on Sn-58 % Bi solder joints with various substrate metallizations under current stress-Reference-Cited by-同舟云学术

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Electromigration effect on Sn-58 % Bi solder joints with various substrate metallizations under current stress

Published:2015-10-14 Issue:2 Volume:27 Page:1105-1112
ISSN:0957-4522
Container-title:Journal of Materials Science: Materials in Electronics
language:en
Short-container-title:J Mater Sci: Mater Electron

Author:

Lee Sang-Min,Yoon Jeong-Won,Jung Seung-Boo

Publisher

Springer Science and Business Media LLC

Subject

Electrical and Electronic Engineering,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Link

http://link.springer.com/content/pdf/10.1007/s10854-015-3858-6.pdf

Reference37 articles.

1. C. Chen, H.M. Tong, K.N. Tu, Annu. Rev. Mater. Res. 40, 51 (2010)

2. T.C. Chiu, K.L. Lin, J. Mater. Res. 23, 264 (2008)

3. D. Yang, Y.C. Chan, B.Y. Wu, M. Pecht, J. Mater. Res. 23, 2333 (2008)

4. K.N. Tu, J. Appl. Phys. 94, 5451 (2003)

5. E.C.C. Yeh, W.J. Choi, K.N. Tu, P. Elenius, H. Balkan, Appl. Phys. Lett. 80, 580 (2002)

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4. The Failure of Sn-Bi-Based Solder Joints Due to Current Stressing;Journal of Electronic Materials;2022-12-03

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