Current density dependence of electromigration-induced flip-chip Cu pad consumption
Author:
Publisher
AIP Publishing
Subject
Physics and Astronomy (miscellaneous)
Link
http://aip.scitation.org/doi/pdf/10.1063/1.2344857
Reference13 articles.
1. Failure Modes of Flip Chip Solder Joints Under High Electric Current Density
2. Electromigration-induced failure in flip-chip solder joints
3. Electromigration studies on Sn(Cu) alloy lines
4. Prevention of electromigration-induced Cu pad dissolution by using a high electromigration-resistance ternary Cu–Ni–Sn layer
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3. Prediction of Electromigration Critical Current Density in Passivated Arbitrary-Configuration Interconnect;Journal of Electronic Packaging;2019-04-10
4. The amorphous interphase formed in an intermetallic-free Cu/Sn couple during early stage electromigration;Scripta Materialia;2018-10
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