Electromigration studies on Sn(Cu) alloy lines-Reference-Cited by-同舟云学术

Electromigration studies on Sn(Cu) alloy lines

Published:2003-12 Issue:12 Volume:32 Page:1515-1522
ISSN:0361-5235
Container-title:Journal of Electronic Materials
language:en
Short-container-title:Journal of Elec Materi

Author:

Lu C. C.,Wang S. J.,Liu C. Y.

Publisher

Springer Science and Business Media LLC

Subject

Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Link

http://link.springer.com/content/pdf/10.1007/s11664-003-0123-1.pdf

Reference19 articles.

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3. S. Brandenberg and S. Yeh, SMI 98 Proc. (Edina, MN: Surface Mount Technology Association, 1998), pp. 337–344.

4. T.Y. Lee and K.N. Tu, J. Appl. Phys. 90, 4502 (2001).

5. T.Y. Lee, K.N. Tu, S.M. Kuo, and D.R. Frear, J. Appl. Phys. 89, 3189 (2001).

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