The Dynamic Behavior of Electromigration in a Novel Cu Tall Pillar/Cu Via Interconnect for Fan-out Packaging-Reference-Cited by-同舟云学术

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The Dynamic Behavior of Electromigration in a Novel Cu Tall Pillar/Cu Via Interconnect for Fan-out Packaging

Published:2021-06 Issue: Volume: Page:
ISSN:
Container-title:2021 IEEE 71st Electronic Components and Technology Conference (ECTC)
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Author:

Liang Chien-Lung,Tsai Min-Yan,Lin Yung-Sheng,Lin I-Ting,Yang Sheng-Wen,Huang Min-Lung,Fang Jen-Kuang,Lin Kwang-Lung

Funder

Ministry of Science and Technology, Taiwan

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9501397/9501403/09501653.pdf?arnumber=9501653

Cited by 9 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Applications of Ni and Ag metallizations at the solder/Cu interfaces in advanced high-power automobile interconnects: An electromigration study;Surface and Coatings Technology;2024-05

2. Microstructure and growth of Cu hillock on redistribution line under electromigration;Journal of Materials Science: Materials in Electronics;2024-03

3. An Electromigration Study of Cu Pillar Interconnects in Flip-chip QFN Packaging under Extreme Conditions for High-power Applications;2023 IEEE 25th Electronics Packaging Technology Conference (EPTC);2023-12-05

4. Materials Quest for Advanced Interconnect Metallization in Integrated Circuits;Advanced Science;2023-06-15

5. Electromigration in three-dimensional integrated circuits;Applied Physics Reviews;2023-05-16

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