An Electromigration Study of Cu Pillar Interconnects in Flip-chip QFN Packaging under Extreme Conditions for High-power Applications
Author:
Affiliation:
1. Advanced Semiconductor Engineering (ASE),Corporate Research and Development (CRD),Kaohsiung,Taiwan
2. National Taiwan University of Science and Technology,Department of Materials Science and Engineering,Taipei,Taiwan
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/10457288/10457581/10457564.pdf?arnumber=10457564
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1. Heterogeneous 2.5D integration on through silicon interposer
2. Reliability challenges in 3D IC packaging technology
3. Electromigration Reliability of Advanced High-Density Fan-Out Packaging With Fine-Pitch 2-/2-μm L/S Cu Redistribution Lines
4. Electromigration Failure Study of a Fine-pitch 2μm/2μm L/S Cu Redistribution Line Embedded in Polyimide for Advanced High-density Fan-out Packaging
5. Athermal and thermal coupling electromigration effects on the microstructure and failure mechanism in advanced fine-pitch Cu interconnects under extremely high current density
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