Athermal and thermal coupling electromigration effects on the microstructure and failure mechanism in advanced fine-pitch Cu interconnects under extremely high current density

Author:

Liang Chien-LungORCID,Lin Yung-Sheng,Kao Chin-Li,Tarng David,Wang Shan-Bo,Hung Yun-Ching,Lin Gao-Tian,Lin Kwang-Lung

Funder

ASE

Ministry of Science and Technology, Taiwan

MOST

Publisher

Elsevier BV

Subject

Condensed Matter Physics,General Materials Science

Reference55 articles.

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4. InFO (wafer level integrated fan-out) technology;Tseng,2016

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