Study of electromigration resistance of (Pd,Ni)Sn4 phase in lead-free solder joints
Author:
Funder
Ministry of Science and Technology of Taiwan
Publisher
Elsevier BV
Subject
Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials
Reference24 articles.
1. Electromigration and thermomigration in Pb-free flip-chip solder joints;Chen;Annu. Rev. Mater. Res.,2010
2. Effect of Al-trace dimension on Joule heating and current crowding in flip-chip solder joints under accelerated electromigration;Liang;Appl. Phys. Lett.,2006
3. Analysis and experimental verification of the competing degradation mechanisms for solder joints under electron current stressing;Ke;Acta Mater.,2011
4. Infrared microscopy of hot spots induced by Joule heating in flip-chip SnAg solder joints under accelerated electromigration;Chiu;Appl. Phys. Lett.,2006
5. Electromigration-induced failure in flip chip solder joints;Lin;J. Electron. Mater.,2005
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3. New challenges of miniaturization of electronic devices: Electromigration and thermomigration in lead-free solder joints;Materials & Design;2020-07
4. First-Principles Study of Structural, Elastic, and Thermodynamic Properties of PdSn4 with Ni Addition;Journal of Electronic Materials;2019-11-26
5. The study on reliability of Ni-coated graphene doped SAC305 lead-free composite solders under high current-density stressing;Soldering & Surface Mount Technology;2019-09-02
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