Thermomechanical study of AlCu based interconnect under pulsed thermoelectric excitation
Author:
Publisher
AIP Publishing
Subject
General Physics and Astronomy
Link
http://aip.scitation.org/doi/pdf/10.1063/1.363985
Reference27 articles.
1. Mechanical properties of Al and Al alloys and their relationship to interconnection reliability
2. Electromigration Failure and Mechanical Stress in thin Film Conductors
3. Electromigration Damage by Current Induced Coalescence of Thermal Stress Voids
4. On the theory of thermal stresses in a thin film on a ceramic substrate
5. Stress distribution in an aluminum interconnect of very large scale integration
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