Interconnect Joule Heating under Transient Currents using the Transmission Line Matrix Method
Author:
Affiliation:
1. G.W. Woodruff School of Mechanical Engineering, Georgia Institute of Technology, Atlanta, GA, 30332
2. Advanced Micro Devices, Inc., Markham, ON, Canada, L3T-7X6
Abstract
Publisher
ASME International
Subject
Electrical and Electronic Engineering,Computer Science Applications,Mechanics of Materials,Electronic, Optical and Magnetic Materials
Link
http://asmedigitalcollection.asme.org/electronicpackaging/article-pdf/doi/10.1115/1.4006137/5643581/011009_1.pdf
Reference15 articles.
1. Thermomechanical Study of AlCu Based Interconnect Under Pulsed Thermoelectric Excitation;Phan;J. Appl. Phys.
2. Thermomechanical Failures in Microelectronic Interconnects;Evans;Microelectron. Reliab.
3. Experimental Study on Electric-Current Induced Damage Evolution at the Crack Tip in Thin Film Conductors;Bastawros;Trans. ASME J. Electron. Packag.
4. Static Temperature Distribution in IC Chips with Isothermal Heat Sources;Bilotti;IEEE Trans. Electron Devices
5. iTEM: A Temperature-Dependent Electromigration Reliability Diagnosis Tool;Teng;IEEE Trans. Comput.-Aided Des.
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