Stress distribution in an aluminum interconnect of very large scale integration
Author:
Publisher
AIP Publishing
Subject
General Physics and Astronomy
Link
http://aip.scitation.org/doi/pdf/10.1063/1.347137
Reference8 articles.
1. Measurement and Interpretation of stress in aluminum-based metallization as a function of thermal history
2. Elastic calculation of the thermal strains and stresses of the multilayered plate
3. Analysis of thermal stress‐induced grain boundary cavitation and notching in narrow Al‐Si metallizations
4. A model for stress-induced metal notching and voiding in very large-scale-integrated Al–Si (1%) metallization
5. Stress-induced grain boundary fractures in Al–Si interconnects
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