Analysis of thermal stress‐induced grain boundary cavitation and notching in narrow Al‐Si metallizations
Author:
Publisher
AIP Publishing
Subject
Physics and Astronomy (miscellaneous)
Link
http://aip.scitation.org/doi/pdf/10.1063/1.100113
Reference9 articles.
1. Stress-induced grain boundary fractures in Al–Si interconnects
2. A model for stress-induced metal notching and voiding in very large-scale-integrated Al–Si (1%) metallization
3. Measurement and Interpretation of stress in aluminum-based metallization as a function of thermal history
4. Stress relaxation and hillock growth in thin films
5. The growth of grain-boundary voids under stress
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