The growth of grain-boundary voids under stress-Reference-Cited by-同舟云学术

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The growth of grain-boundary voids under stress

Published:1959-06 Issue:42 Volume:4 Page:673-687
ISSN:0031-8086
Container-title:Philosophical Magazine
language:en
Short-container-title:Philosophical Magazine

Author:

Hull D.,Rimmer D. E.

Publisher

Informa UK Limited

Link

http://www.tandfonline.com/doi/pdf/10.1080/14786435908243264

Reference8 articles.

1. Growth of voids in metals during diffusion and creep

2. On the mechanism of intelcrystalline cracking

3. A mechanism for the formation of intergranular cracks when boundary sliding occurs

4. Intergranular cavitation in stressed metals

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