On the theory of thermal stresses in a thin film on a ceramic substrate
Author:
Publisher
AIP Publishing
Subject
General Physics and Astronomy
Link
http://aip.scitation.org/doi/pdf/10.1063/1.356438
Reference3 articles.
1. Analysis of thermal stress‐induced grain boundary cavitation and notching in narrow Al‐Si metallizations
2. Kinetic study of Si recrystallization in the reaction between Au and polycrystalline-Si films
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