Abstract
ABSTRACTThe role of mechanical stress in electromigration of thin films is reviewed and discussed. The role of stress in the driving force and the diffusivity are seen both to be important. The concept of the activation volume is discussed with regard to information available from its measurement. It is seen that void nucleation by electromigration or stress voiding is an unsolved theoretical problem.
Publisher
Springer Science and Business Media LLC
Cited by
5 articles.
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