Stress and Electromigration-Reference-Cited by-同舟云学术

Stress and Electromigration

Published:1995 Issue: Volume:391 Page:
ISSN:0272-9172
Container-title:MRS Proceedings
language:en
Short-container-title:MRS Proc.

Author:

Lloyd J.R.

Abstract

The interdependence of mechanical stress and electromigration behavior has been recognized for quite some time, but has only begun to be fully appreciated and dealt with in a meaningful manner. There have been a number of recent advances in understanding that also may lead to a change in the way that electromigration failure is viewed in real applications.

Publisher

Springer Science and Business Media LLC

Subject

General Engineering

Reference51 articles.

1. Interpretation of Resistance Changes during Interconnect Reliability Testing

2. Electromigration Failure and Mechanical Stress in thin Film Conductors

3. Measurement and Interpretation of Strain Relaxation in Passivated Al-0.5%Cu Lines

4. Atomistic and computer modeling of metallization failure of integrated circuits by electromigration

5. 25 Grain Boundary Structure and Kinetics, American Society for Metals, Metalsa Park Ohio, (1980)..there are several papers and many micrographs in this volume that support this view

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