Grain size dependence of electromigration‐induced failures in narrow interconnects
Author:
Publisher
AIP Publishing
Subject
Physics and Astronomy (miscellaneous)
Link
http://aip.scitation.org/doi/pdf/10.1063/1.101054
Reference8 articles.
1. Electromigration Damage in Aluminum Film Conductors
2. Dependence of Electromigration‐Induced Failure Time on Length and Width of Aluminum Thin‐Film Conductors
3. Linewidth dependence of electromigration in evaporated Al‐0.5%Cu
4. A model for the width dependence of electromigration lifetimes in aluminum thin‐film stripes
5. Anomalous large grains in alloyed aluminum thin films I. Secondary grain growth in aluminum-copper films
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