Measuring nanograins of 50nm-thick metallization layer using a new approach of EBSD pattern matching
Author:
Affiliation:
1. Oxford Instruments (Singapore),NanoAnalysis,Singapore
2. Oxford Instruments,NanoAnalysis,High Wycombe,UK,HP12 3SE
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/10248978/10248979/10249056.pdf?arnumber=10249056
Reference22 articles.
1. Effects of accelerating voltage and specimen thickness on the spatial resolution of transmission electron backscatter diffraction in Cu
2. Crystallographic Orientation Analysis of Nanocrystalline Tungsten Thin Film Using TEM Precession Electron Diffraction and SEM Transmission Kikuchi Diffraction
3. A Dictionary Approach to Electron Backscatter Diffraction Indexing
4. Many-beam dynamical simulation of electron backscatter diffraction patterns
5. Characterisation of fine-scale microstructures by electron backscatter diffraction (EBSD)
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