Effect of interconnect linewidth on the evolution of intragranular microcracks due to surface diffusion in a gradient stress field and an electric field-Reference-Cited by-同舟云学术

Effect of interconnect linewidth on the evolution of intragranular microcracks due to surface diffusion in a gradient stress field and an electric field

Published:2018-08-31 Issue:3 Volume:13 Page:365-378
ISSN:1559-3959
Container-title:Journal of Mechanics of Materials and Structures
language:en
Short-container-title:J. Mech. Mater. Struct.

Author:

Zhou Linyong,Huang Peizhen,Cheng Qiang

Publisher

Mathematical Sciences Publishers

Subject

Applied Mathematics,Mechanics of Materials

Link

https://msp.org/jomms/2018/13-3/jomms-v13-n3-p08-s.pdf

Reference43 articles.

1. Electromigration—A brief survey and some recent results

2. Diffusional back flows during electromigration

3. Stress generation by electromigration

4. ANALYSIS OF FAILURE MECHANISMS IN THE INTERCONNECT LINES OF MICROELECTRONIC CIRCUITS

5. Analysis of stress‐induced void growth mechanisms in passivated interconnect lines

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