Defect pattern recognition on wafers using convolutional neural networks-Reference-Cited by-同舟云学术

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Defect pattern recognition on wafers using convolutional neural networks

Published:2020-06 Issue:4 Volume:36 Page:1245-1257
ISSN:0748-8017
Container-title:Quality and Reliability Engineering International
language:en
Short-container-title:Qual Reliab Engng Int

Author:

Wang Rui¹^ORCID,Chen Nan¹^ORCID

Affiliation:

1. Department of Industrial Systems Engineering & ManagementNational University of Singapore Singapore

Publisher

Wiley

Subject

Management Science and Operations Research,Safety, Risk, Reliability and Quality

Link

https://onlinelibrary.wiley.com/doi/pdf/10.1002/qre.2627

Reference26 articles.

1. Wafer yield prediction using derived spatial variables

2. Wafer bin map recognition using a neural network approach

3. Hybrid data mining approach for pattern extraction from wafer bin map to improve yield in semiconductor manufacturing

4. Multi-step ART1 algorithm for recognition of defect patterns on semiconductor wafers

5. Design of intelligent data sampling methodology based on data mining

Cited by 33 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Antecedent hash modality learning and representation for enhanced wafer map defect pattern recognition;Expert Systems with Applications;2024-09

2. Correlation analysis of sampled wafer profile maps based on a deep reconstruction model;Applied Soft Computing;2024-07

3. Improved wafer map defect pattern classification using automatic data augmentation based lightweight encoder network in contrastive learning;Journal of Intelligent Manufacturing;2024-07-01

4. Image Hash Layer Triggered CNN Framework for Wafer Map Failure Pattern Retrieval and Classification;ACM Transactions on Knowledge Discovery from Data;2023-12-19

5. Learning from single-defect wafer maps to classify mixed-defect wafer maps;Expert Systems with Applications;2023-12

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