Wafer bin map recognition using a neural network approach
Author:
Publisher
Informa UK Limited
Subject
Industrial and Manufacturing Engineering,Management Science and Operations Research,Strategy and Management
Link
http://www.tandfonline.com/doi/pdf/10.1080/00207540210122275
Reference8 articles.
1. A neural-network approach to recognize defect spatial pattern in semiconductor fabrication
2. Model-free estimation of defect clustering in integrated circuit fabrication
3. The binomial test: a simple tool to identify process problems
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