Hybrid data mining approach for pattern extraction from wafer bin map to improve yield in semiconductor manufacturing-Reference-Cited by-同舟云学术

Hybrid data mining approach for pattern extraction from wafer bin map to improve yield in semiconductor manufacturing

Published:2007-05 Issue:1 Volume:107 Page:88-103
ISSN:0925-5273
Container-title:International Journal of Production Economics
language:en
Short-container-title:International Journal of Production Economics

Author:

Hsu Shao-Chung,Chien Chen-Fu

Publisher

Elsevier BV

Subject

Industrial and Manufacturing Engineering,Management Science and Operations Research,Economics and Econometrics,General Business, Management and Accounting

Reference28 articles.

1. Categorical Data Analysis;Agresti,1990

2. Yield improvement using statistical analysis of process dates;Bergeret;IEEE Transactions on Semiconductor Manufacturing,2003

3. Data mining for improving a cleaning process in the semiconductor industry;Braha;IEEE Transactions on Semiconductor Manufacturing,2002

4. On the use of decision tree induction for discovery of interactions in a photolithographic process;Braha;IEEE Transactions on Semiconductor Manufacturing,2003

5. Classification and Regression Trees;Breiman,1984

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