Characterisation of lead free solderability of immersion Sn finish on PWBs using wetting balance technique
Author:
Publisher
Informa UK Limited
Subject
Materials Chemistry,Surfaces, Coatings and Films,Surfaces and Interfaces,Condensed Matter Physics
Link
http://www.tandfonline.com/doi/pdf/10.1179/174329408X281821
Reference7 articles.
1. Intermetallic phase detection in lead-free solders using synchrotron x-ray diffraction
2. Study of immersion silver and tin printed-circuit-board surface finishes in lead-free solder applications
3. Solderability of Electroless Nickel Alloys Using Wetting Balance Technique
4. Analysis of Surface Roughness of Immersion Sn Plating Film via Micro Etch Process
5. Immersion tin as a high performance solderable finish for fine pitch PWBs
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1. A Weakness of Wetting Balance Method during the Diagnostic of Connector Pins with Wetting Issue;2022 45th International Spring Seminar on Electronics Technology (ISSE);2022-05-11
2. Fabrication of Sn nanostructures by template assisted pulse electrodeposition;Surface Engineering;2016-02-29
3. Effect of current density on morphology of electroplated tin;Surface Engineering;2014-12-04
4. Electrodeposition of SnBi coatings based on deep eutectic solvent;Surface Engineering;2013-12-06
5. Development of SnAg-based lead free solders in electronics packaging;Microelectronics Reliability;2012-03
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