Intermetallic phase detection in lead-free solders using synchrotron x-ray diffraction-Reference-Cited by-同舟云学术

Intermetallic phase detection in lead-free solders using synchrotron x-ray diffraction

Published:2004-12 Issue:12 Volume:33 Page:1524-1529
ISSN:0361-5235
Container-title:Journal of Electronic Materials
language:en
Short-container-title:Journal of Elec Materi

Author:

Jackson Gavin J.,Lu Hua,Durairaj Raj,Hoo Nick,Bailey Chris,Ekere Ndy N.,Wright Jon

Publisher

Springer Science and Business Media LLC

Subject

Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Link

http://link.springer.com/content/pdf/10.1007/s11664-004-0094-x.pdf

Reference9 articles.

1. Department of Trade and Industry, 31 March 2004, http://www.dti.gov.uk/sustainability/weee/.

2. D.R. Frear, S.N. Burchett, H.S. Morgan, and J.H. Lau, The Mechanics of Solder Alloy Interconnects (New York: Van Nostrand Reinhold, 1994).

3. P.G. Harris and K.S. Chaggar, Solder. Surf. Mount Technol. 10, 38 (1998).

4. B. Salam, N.N. Ekere, and D. Rajkumar, 51st Electronics Components and Technology Conf. (Piscataway, NJ: IEEE, 2001), pp. 471–477.

5. European Synchrotron Radiation Facility, “Overview,” 31 March 2004, http://www.esrf.fr/UsersAndScience/Experiments/MaterialsScience/ID11/ID11Overview/.

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