A Weakness of Wetting Balance Method during the Diagnostic of Connector Pins with Wetting Issue-Reference-Cited by-同舟云学术

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A Weakness of Wetting Balance Method during the Diagnostic of Connector Pins with Wetting Issue

Published:2022-05-11 Issue: Volume: Page:
ISSN:
Container-title:2022 45th International Spring Seminar on Electronics Technology (ISSE)
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Author:

Dusek Karel¹,Vesely Petr¹,Fros Denis¹,Kozak Martin¹,Sorokina Kristina¹,Plachy Zbynek¹,Busek David¹,Dusek Jaroslav²,Kralova Iva¹,Klimtova Marketa¹,Placek Martin¹

Affiliation:

1. Czech Technical University in Prague,Faculty of Electrical Engineering,Department of Electrotechnology, Technická 2, Prague 6,Czech Republic,166 27

2. Charles University,First Faculty of Medicine, Institute of Biophysics and Informatics, Salmovská 1, Prague 2,Czech Republic,120 00

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9812704/9812706/09812772.pdf?arnumber=9812772

Reference13 articles.

1. Wetting Balance Measurement of Solders and Evaluation of Strong Influences on the Shape of the Wetting Curves

2. Impact of solder paste drying on the solderability

3. Properties Verification of Improved Lead-free Solder Alloys

4. Influence of the reduced oxygen concentration on the wetting force

5. SOLDERABILITY TESTING

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