Properties Verification of Improved Lead-free Solder Alloys
Author:
Funder
Ministry of Education
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/9467488/9467508/09467573.pdf?arnumber=9467573
Cited by 4 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Contribution to the Calorimetric Study of the Bi-Ni-Sn Ternary System: Experimental and Theoretical Data;Biointerface Research in Applied Chemistry;2022-07-10
2. Compact numerical modelling of transient condensate layer formation on small components during vapour phase soldering;International Communications in Heat and Mass Transfer;2022-06
3. A Weakness of Wetting Balance Method during the Diagnostic of Connector Pins with Wetting Issue;2022 45th International Spring Seminar on Electronics Technology (ISSE);2022-05-11
4. Flow and Gauge Sensor Fusion in Vapour Phase Soldering Ovens for Optimized Process Control;2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC);2021-12-07
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