Compact numerical modelling of transient condensate layer formation on small components during vapour phase soldering
Author:
Funder
NKFIH
Publisher
Elsevier BV
Subject
Condensed Matter Physics,General Chemical Engineering,Atomic and Molecular Physics, and Optics
Reference31 articles.
1. Dampfphasenlöten: Grundlagen und praktische Anwendung;Leider,2002
2. Modeling method of heat transfer during vapour phase soldering based on filmwise condensation theory;Géczy;Int. J. Heat Mass Transf.,2013
3. Numerical simulation of condensate layer formation during vapour phase soldering;Illés;Int. J. Heat Mass Transf.,2014
4. Effects of substrate thermal properties on the heat transfer coefficient of vapour phase soldering;Illés;Int. J. Heat Mass Transf.,2016
5. Numerical investigation on the effect of condensate layer formation around large-size components during vapour phase soldering;Illés;Int. J. Heat Mass Transf.,2018
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