Numerical investigation on the effect of condensate layer formation around large-size components during vapour phase soldering-Reference-Cited by-同舟云学术

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Numerical investigation on the effect of condensate layer formation around large-size components during vapour phase soldering

Published:2018-10 Issue: Volume:125 Page:202-209
ISSN:0017-9310
Container-title:International Journal of Heat and Mass Transfer
language:en
Short-container-title:International Journal of Heat and Mass Transfer

Author:

Illés Balázs,Géczy Attila,Krammer Olivér,Dušek Karel,Bušek David

Funder

János Bolyai Research Scholarship of the Hungarian Academy of Sciences

Publisher

Elsevier BV

Subject

Fluid Flow and Transfer Processes,Mechanical Engineering,Condensed Matter Physics

Reference27 articles.

1. Heat pump model for Ranque-Hilsch vortex tubes;Kolmes;Int. J. Heat Mass Transf.,2017

2. Numerical study on condensation heat transfer and pressure drop characteristics of ethane/propane mixture upward flow in a spiral pipe;Li;Int. J. Heat Mass Transf.,2018

3. An experimental study of loop heat pipes with steam jet pump;Kiseev;Int. J. Heat Mass Transf.,2017

4. F.L. Chang, Y.M. Hung, Dielectric liquid pumping flow in optimally operated micro heat pipes, Int. J. Heat Mass Transf. 108/A (2017) 257–270.

5. Simulation, optimization and experimental verification of the over-pressure reflow soldering process;Esfandyari;Proc. CIRP,2017

Cited by 8 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Improving efficiency of vapour phase soldering ovens with pressure and temperature-based process monitoring;Case Studies in Thermal Engineering;2024-05

2. Compact numerical modelling of transient condensate layer formation on small components during vapour phase soldering;International Communications in Heat and Mass Transfer;2022-06

3. Heat Level Mode in Vapour Phase Soldering Using Lead-Free Solder Paste for Surface Mount Technology: A Review;Lecture Notes in Mechanical Engineering;2021

4. Compact Numerical Modelling of Transient Condensate Layer Formation on Small Components During Vapour Phase Soldering;SSRN Electronic Journal;2021

5. Numerical simulation of reflow ovens;Reflow Soldering;2020

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