Heat Level Mode in Vapour Phase Soldering Using Lead-Free Solder Paste for Surface Mount Technology: A Review
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Publisher
Springer Singapore
Link
https://link.springer.com/content/pdf/10.1007/978-981-16-0866-7_57
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1. Flow and Gauge Sensor Fusion in Vapour Phase Soldering Ovens for Optimized Process Control;2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC);2021-12-07
2. Compact Numerical Modelling of Transient Condensate Layer Formation on Small Components During Vapour Phase Soldering;SSRN Electronic Journal;2021
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