Improving efficiency of vapour phase soldering ovens with pressure and temperature-based process monitoring

Author:

Havellant Gergő,Illés BalázsORCID,Bušek David,Géczy AttilaORCID

Funder

National Science Centre Poland

Narodowym Centrum Nauki

Nemzeti Kutatasi Fejlesztesi es Innovacios Hivatal

Nemzeti Kutatási Fejlesztési és Innovációs Hivatal

Publisher

Elsevier BV

Reference26 articles.

1. Vapor phase for lead-free reflow;Suihkonen;Glob. SMT Packag.,2007

2. Numerical investigation on the effect of condensate layer formation around large-size components during vapour phase soldering;Illés;Int. J. Heat Mass Trans.,2018

3. Galden LS & HS Vapor Phase Soldering Fluids, Technical Data Sheet. https://content.solvay.com/Galden-ls/hs-vapor-phase-soldering-fluids, (accessed 23.01.2023).

4. Review of vapor condensation heat and mass transfer in the presence of non-condensable gas;Huang;Appl. Therm. Eng.,2015

5. Development of Warpage measurement system to simulate convective solder reflow process;Powell;IEEE Trans. Electron. Packag. Manuf.,2008

Cited by 1 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. Increasing Productivity in Vapour Phase Soldering Using Vertical Stacking of Boards;2024 47th International Spring Seminar on Electronics Technology (ISSE);2024-05-15

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