Author:
Géczy Attila,Illés Balázs,Illyefalvi-Vitéz Zsolt
Subject
Fluid Flow and Transfer Processes,Mechanical Engineering,Condensed Matter Physics
Reference25 articles.
1. H. Leicht, A. Thumm, Today’s vapor phase soldering – an optimized reflow technology for lead free soldering, in: Proceedings of the Surface Mount Technology Association Int. Conf., USA, 2008, p. 45.
2. R.C. Pfahl, H.H. Ammann, Method for soldering, fusing or bracing, US Patent 3,866,307, 1975.
3. Dampfphasenlöten – Grundlagen und Praktische Anwendung;Leider,2002
4. O. Krammer, T. Garami, Investigating the mechanical strength of vapor phase soldered chip components joints, in: Proceedings of IEEE Int. Symposium for Design and Technology in Electronic Packaging at Pitesti, Romania, 2010, pp. 103–106.
5. I. Plotog, T. Cueu, B. Mihaileseu, G. Varzaru, P. Svasta, I. Busu, PCBs with different core materials assembling in vapor phase soldering technology, in: Proceedings of IEEE ISETC Ninth International Symposium on Electronics and Telecommunications, Romania, 2010, pp. 421–424.
Cited by
17 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献