Research on Thermal Simulation Improving the Components’ Soldering Quality in Electronic Module

Abstract

Abstract This paper describes a method that could exactly optimize and improve the soldering quality of the electronic module. Firstly, a sample of temperature measurement was proposed. Through the temperature rising, heat preservation, temperature rising, soldering and cooling, the sensors could able to accurately and sensibly record and present each temperature data which set on the sample. At the same time the soldering cure was also measured. Secondly, through the analysis and research of vapor-phase soldering technology based on condensation theory, referring to the relevant modeling and simulation analysis methods, a thermal simulation model was established (size: 13.7mm × 45mm × 16.5mm). The ANSYS was used in this thermal simulation and the measured temperature curve, material parameters and other boundary conditions were loaded. The transient thermal simulation method was adopted and the temperature variation on sample during vapor-phase soldering was simulated. A maximum error of 2.67°C between simulation and measurement results, error rate is only 1.2%. Therefore, this simulation method can effectively perform the change of temperature with time in the real vapor-phase soldering process. After that, the optimized vapor-phase soldering temperature curve and soldering process parameters were used to carry out the vacuum vapor-phase soldering test in the assembly. The dimensions, materials and other parameters of the components used in the test were completely consistent with the simulation model. Two Sn63Pb37 solder rings were used in the test and the vacuum was also carried out. Through the X-ray inspection results, the optimized vapor phase soldering temperature curve has no soldering voids and well soldering consistency, which meets the requirements of high-quality soldering and improves the assembly quality of electronic products.