Investigations on Component Attachment Process and Noise Sustain Mechanism in Quad Channel High Gain Phase Matched Receiver-Reference-Cited by-同舟云学术

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Investigations on Component Attachment Process and Noise Sustain Mechanism in Quad Channel High Gain Phase Matched Receiver

Published:2024-07 Issue:7 Volume:14 Page:1281-1291
ISSN:2156-3950
Container-title:IEEE Transactions on Components, Packaging and Manufacturing Technology
language:
Short-container-title:IEEE Trans. Compon., Packag. Manufact. Technol.

Author:

Kumar Vipin¹^ORCID,Sivakumar R.¹,Ghosh Jayanta²^ORCID

Affiliation:

1. Bharat Electronics Ltd., Bengaluru, India

2. National Institute of Technology, Patna, India

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Link

http://xplorestaging.ieee.org/ielx7/5503870/10638331/10538127.pdf?arnumber=10538127

Reference29 articles.

1. Reduction of voids in solder joints an alternative to vacuum soldering;Diehm

2. Influence of type of reflow technology and type of surface finish on tomb stone effect

3. Protection of tombstone problems for small chip devices

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