Solderability of Electroless Nickel Alloys Using Wetting Balance Technique-Reference-Cited by-同舟云学术

登录注册会员服务联系我们

Solderability of Electroless Nickel Alloys Using Wetting Balance Technique

Published:1994-08-15 Issue:Part 1, No. 8 Volume:33 Page:4708-4713
ISSN:0021-4922
Container-title:Japanese Journal of Applied Physics
language:en
Short-container-title:Jpn. J. Appl. Phys.

Author:

Lee Chwan-Ying,Lin Kwang-Lung

Publisher

IOP Publishing

Subject

General Physics and Astronomy,Physics and Astronomy (miscellaneous),General Engineering

Cited by 39 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Solderability of additively manufactured pure copper and the effect of surface modification;The International Journal of Advanced Manufacturing Technology;2024-05-20

2. The feasibility study of replacing the traditional amorphous Ni-P with an amorphous Ni-Cu-P layer;Journal of Materials Science: Materials in Electronics;2024-04

3. Amino Acids as Activators for Wave Solder Flux Systems: Investigation of Solderability and Humidity Effects;IEEE Transactions on Components, Packaging and Manufacturing Technology;2022-05

4. Highly solderability of FeP film in contact with SnAgCu solder;Journal of Alloys and Compounds;2020-03

5. Investigation of Friction and Wear Properties of Electroless Ni–P–Cu Coating Under Dry Condition;Journal of Molecular and Engineering Materials;2016-12

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370

www.globalauthorid.com

TOP