The feasibility study of replacing the traditional amorphous Ni-P with an amorphous Ni-Cu-P layer
Author:
Funder
National Natural Science Foundation of China
Publisher
Springer Science and Business Media LLC
Link
https://link.springer.com/content/pdf/10.1007/s10854-024-12457-z.pdf
Reference24 articles.
1. Y. Yang, J.N. Balaraju, Y. Huang et al., Interface reaction between an electroless Ni-Co-P metallization and Sn-3.5Ag lead-free solder with improved joint reliability. Acta Mater. 71, 69–79 (2014). https://doi.org/10.1016/j.actamat.2014.02.026
2. J. Görlich, B. Dietmar, S. Guido, Reaction kinetics of Ni/Sn soldering reaction. Acta Mater. 58(9), 3187–3197 (2010). https://doi.org/10.1016/j.actamat.2010.01.027
3. M. Mita, M. Kajihara, N. Kurokawa et al., Growth behavior of Ni3Sn4 layer during reactive diffusion between Ni and Sn at solid-state temperatures. Mater. Sci. Eng. A 403(1–2), 269–275 (2005). https://doi.org/10.1016/j.msea.2005.05.012
4. T. Takenaka, S. Kano, M. Kajihara et al., Growth behavior of compound layers in Sn/Cu/Sn diffusion couples during annealing at 433–473K. Mater. Sci. Eng. A 396(1–2), 115–123 (2005). https://doi.org/10.1016/j.msea.2005.01.025
5. X. Bi, X. Hu, Q. Li, Effect of Co addition into Ni film on shear strength of solder/Ni/Cu system: experimental and theoretical investigations. Mater. Sci. Eng. A (2020). https://doi.org/10.1016/j.msea.2020.139589
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