Growth behavior of compound layers in Sn/Cu/Sn diffusion couples during annealing at 433–473K
Author:
Publisher
Elsevier BV
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Reference16 articles.
1. Interdiffusion and reaction in bimetallic Cu-Sn thin films
2. Temperature Aging of External Connections Condensation Soldered to Ti-Pd-Au Thin Films
3. Soldering external connections to thin film systems
4. Effects of intermetallic formation at the interface between copper and lead-tin solder
Cited by 102 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Facile synthesis of Cu-Sn nanoparticle film and its bonding mechanism for power electronic packaging;Journal of Materials Processing Technology;2024-08
2. The feasibility study of replacing the traditional amorphous Ni-P with an amorphous Ni-Cu-P layer;Journal of Materials Science: Materials in Electronics;2024-04
3. MODIFIED STEFAN CONDITION IN STEFAN PROBLEM;Problems of Atomic Science and Technology;2023-10-12
4. Facile Synthesis of Cu-Sn Nanoparticle Film and its Bonding Mechanism for Power Electronic Packaging;2023
5. High-temperature effects on kinetics and grain orientation of the Cu41Sn11 phase formed from the full Cu3Sn joint during the aging process;Materials Chemistry and Physics;2022-10
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3