Electrodeposition of SnBi coatings based on deep eutectic solvent
Author:
Publisher
Informa UK Limited
Subject
Materials Chemistry,Surfaces, Coatings and Films,Surfaces and Interfaces,Condensed Matter Physics
Link
http://www.tandfonline.com/doi/pdf/10.1179/1743294413Y.0000000198
Reference27 articles.
1. Lead contamination of a transient liquid-phase-processed Sn-Bi lead-free solder paste
2. The effect of Pb contamination on the solidification behavior of Sn-Bi solders
3. Development of SnAg-based lead free solders in electronics packaging
4. Characterisation of lead free solderability of immersion Sn finish on PWBs using wetting balance technique
5. Interfacial Reactions between Eutectic SnZn Solder and Bulk or Thin-Film Cu Substrates
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3. Electrodeposition of Tin-Reduced Graphene Oxide Composite from Deep Eutectic Solvents Based on Choline Chloride and Ethylene Glycol;Metals;2023-01-19
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