1. Mechanical performance of advanced multicomponent lead-free solder alloy under thermal aging;Zhou;Mater. Today Commun.,2022
2. A review of developments in the electrodeposition of tin;Walsh;Surf. Coat. Technol.,2016
3. Q.-h. Li, W.-w. Chen, W. Li, A study on microstructure of tin-lead solder joints under thermal cycling, in: Proceedings of the 2016 17th International Conference on Electronic Packaging Technology (ICEPT), IEEE, 2016, pp. 856–9.
4. Strength and isothermal fatigue resistance of SnBi/SnAgCu joints reflowed at low temperatures;Yadav;J. Electron. Packag.,2022
5. Electrodeposition of Pb-free Sn alloys in pulsed current;Neveu;Appl. Surf. Sci.,2006