A review of developments in the electrodeposition of tin-Reference-Cited by-同舟云学术

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A review of developments in the electrodeposition of tin

Published:2016-02 Issue: Volume:288 Page:79-94
ISSN:0257-8972
Container-title:Surface and Coatings Technology
language:en
Short-container-title:Surface and Coatings Technology

Author:

Walsh F.C.^ORCID,Low C.T.J.

Funder

Research Institute for Industry at Southampton University

Publisher

Elsevier BV

Subject

Materials Chemistry,Surfaces, Coatings and Films,Surfaces and Interfaces,Condensed Matter Physics,General Chemistry

Reference76 articles.

1. www.http://enthone.com/Industries/Electronics_Solutions.aspx; (accessed 12 November 2015).

2. Electrodeposition of copper–tin alloys;Brenner,1963

3. The Electrodeposition of Tin and its Alloys;Jordan,1995

4. Principles of Metal Surface Treatment and Protection;Gabe,1978

5. Environmental benefits of methanesulfonic acid

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