The effect of Pb contamination on the solidification behavior of Sn-Bi solders-Reference-Cited by-同舟云学术

The effect of Pb contamination on the solidification behavior of Sn-Bi solders

Published:2001-01 Issue:1 Volume:30 Page:45-52
ISSN:0361-5235
Container-title:Journal of Electronic Materials
language:en
Short-container-title:Journal of Elec Materi

Author:

Moon Kil-Won,Boettinger William J.,Kattner Ursula R.,Handwerker Carol A.,Lee Doh-Jae

Publisher

Springer Science and Business Media LLC

Subject

Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Link

http://link.springer.com/content/pdf/10.1007/s11664-001-0213-x.pdf

Reference13 articles.

1. Lead-Free Solder Project Final Report, NCMS Report 0401RE96 (Ann Arbor, MI: National Center for Manufacturing Sciences, Aug. 1997).

2. Fay Hua, Zequn Mei, and Judy Glazer, IEEE Electron. Compon. and Technol. Conf. (Piscataway, NJ: IEEE, 1998), pp. 277–283.

3. J. Glazer, Int. Mater. Rev. 40, 65 (1995).

4. H. Schumann, Metallographie (Leipzig, Germany: VEB Verlag, 1974), pp. 229–230.

5. P. Villars, A. Prince, and H. Okamoto, editors, Handbook of Ternary Alloy Phase Diagrams, Vol. 5 (Materials Park, OH: ASM Int., 1995), pp. 6373–6780.

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