A fast thermal-aware fixed-outline floorplanning methodology based on analytical models
Author:
Affiliation:
1. National Cheng Kung University, Tainan, Taiwan
2. Industrial Technology Research Institute, Hsinchu, Taiwan
Publisher
ACM
Link
https://dl.acm.org/doi/pdf/10.1145/3240765.3240769
Reference24 articles.
1. Partition-driven standard cell thermal placement
2. NTUplace3: An Analytical Placer for Large-Scale Mixed-Size Designs With Preplaced Blocks and Density Constraints
3. Full-Chip Thermal Analysis for the Early Design Stage via Generalized Integral Transforms
Cited by 6 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Fast power density aware three‐dimensional integrated circuit floorplanning for hard macroblocks using best operator combination genetic algorithm;International Journal of Circuit Theory and Applications;2023-05-29
2. Thermal-Aware SoC Macro Placement and Multi-chip Module Design Optimization with Bayesian Optimization;2023 IEEE 73rd Electronic Components and Technology Conference (ECTC);2023-05
3. TOFU: A Two-Step Floorplan Refinement Framework for Whitespace Reduction;2023 Design, Automation & Test in Europe Conference & Exhibition (DATE);2023-04
4. Progress of Placement Optimization for Accelerating VLSI Physical Design;Electronics;2023-01-09
5. Generalizable Floorplanner through Corner Block List Representation and Hypergraph Embedding;Proceedings of the 28th ACM SIGKDD Conference on Knowledge Discovery and Data Mining;2022-08-14
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3