Full-Chip Thermal Analysis for the Early Design Stage via Generalized Integral Transforms
Author:
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Hardware and Architecture,Software
Link
http://xplorestaging.ieee.org/ielx5/92/4839067/04799219.pdf?arnumber=4799219
Cited by 21 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Rectangular Approximation for Curved-Shape Power Density in Chip Thermal Analysis;2024 2nd International Symposium of Electronics Design Automation (ISEDA);2024-05-10
2. A Stepwise Integration Separation of Variables Solver for Full-Chip Thermal Uncertainty Analysis;IEEE Transactions on Components, Packaging and Manufacturing Technology;2024-04
3. ATT-TA: A Cooperative Multiagent Deep Reinforcement Learning Approach for TSV Assignment in 3-D ICs;IEEE Transactions on Very Large Scale Integration (VLSI) Systems;2023-12
4. VarSim: A fast process variation-aware thermal modeling methodology using Green’s functions;Microelectronics Journal;2023-12
5. Fast Full-Chip Parametric Thermal Analysis Based on Enhanced Physics Enforced Neural Networks;2023 IEEE/ACM International Conference on Computer Aided Design (ICCAD);2023-10-28
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