Rectangular Approximation for Curved-Shape Power Density in Chip Thermal Analysis-Reference-Cited by-同舟云学术

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Rectangular Approximation for Curved-Shape Power Density in Chip Thermal Analysis

Published:2024-05-10 Issue: Volume: Page:632-636
ISSN:
Container-title:2024 2nd International Symposium of Electronics Design Automation (ISEDA)
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Author:

Wang Ao¹,Yin Luqiao¹,Zhu Wenxing²,Guo Aiying¹,Liu Jingjing¹,Tang Min³,Chen Liang¹,Zhang Jianhua¹

Affiliation:

1. School of Microelectronics, Shanghai University,Shanghai,China,201800

2. Fuzhou University,Center for Discrete Mathematics and Theoretical Computer Science,Fuzhou,China,350108

3. Shanghai Jiao Tong University,State Key Laboratory of Radio Frequency Heterogeneous Integration,Shanghai,China,200240

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx8/10616249/10617469/10617658.pdf?arnumber=10617658

Reference7 articles.

1. A Reliability Enhanced 5nm CMOS Technology Featuring 5th Generation FinFET with Fully-Developed EUV and High Mobility Channel for Mobile SoC and High Performance Computing Application

2. Efficient thermal placement of standard cells in 3D ICs using a force directed approach

3. HotSpot: a compact thermal modeling methodology for early-stage VLSI design

4. High-Efficiency Green Function-Based Thermal Simulation Algorithms

5. Full-Chip Thermal Analysis for the Early Design Stage via Generalized Integral Transforms

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