1. A novel thermal-aware floorplanning and tsv assignment with game theory for fixed-outline 3-D ICs;Guan;IEEE Trans. Very Large Scale Integr. (VLSI) Syst.,2023
2. Thermal layout optimization for 3D stacked multichip modules;Chen;Microelectron. J.,2023
3. Electrothermal analysis and optimization techniques for nanoscale integrated circuits;Zhan,2006
4. ISAC: Integrated space-and-time-adaptive chip-package thermal analysis;Yang;IEEE TCAD,2006
5. A fast leakage aware thermal simulator for 3D chips;Sultan,2017